发明授权
- 专利标题： Adhesive composition and adhesion method
- 专利标题（中）： 粘合剂组合物和粘合方法
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申请号： US13122020申请日： 2009-10-08
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公开(公告)号： US08273827B2公开(公告)日： 2012-09-25
- 发明人: Yuki Hisha , Kimihiko Yoda , Kazuhiro Oshima
- 申请人： Yuki Hisha , Kimihiko Yoda , Kazuhiro Oshima
- 申请人地址： JP Tokyo
- 专利权人： Denki Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人： Denki Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Hoffmann & Baron, LLP
- 优先权： JP2008-262015 20081008
- 国际申请： PCT/JP2009/067543 WO 20091008
- 国际公布： WO2010/041710 WO 20100415
- 主分类号： C08F8/00
- IPC分类号： C08F8/00 ; C08L33/02 ; C08L33/04 ; C08L35/02
摘要：
Disclosed is an adhesive composition having adhesion properties, high-speed curing properties and moisture resistance. Also disclosed is an adhesion method. Specifically disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (C) a compound having an enal structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (D) a compound having an amine structure, and (E) a compound containing copper. Also disclosed is a composition which comprises: a first preparation comprising (A) a nitrile-butadiene rubber, (B) a (meth)acrylic composition, (D) a compound having an amine structure, and (F) a radical polymerization initiator; and a second preparation comprising (A) the nitrile-butadiene rubber, (B) the (meth)acrylic composition, (C) a compound having an enal structure, and (E) a compound containing copper.
公开/授权文献
- US20110190414A1 ADHESIVE COMPOSITION AND ADHESION METHOD 公开/授权日：2011-08-04
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