发明授权
US08272348B2 Method for plasma deposition and plasma CVD system 有权
等离子体沉积和等离子体CVD系统的方法

  • 专利标题: Method for plasma deposition and plasma CVD system
  • 专利标题(中): 等离子体沉积和等离子体CVD系统的方法
  • 申请号: US12811333
    申请日: 2008-02-26
  • 公开(公告)号: US08272348B2
    公开(公告)日: 2012-09-25
  • 发明人: Masayasu Suzuki
  • 申请人: Masayasu Suzuki
  • 申请人地址: JP Kyoto
  • 专利权人: Shimadzu Corporation
  • 当前专利权人: Shimadzu Corporation
  • 当前专利权人地址: JP Kyoto
  • 代理机构: J.C. Patents
  • 优先权: JPPCT/JP2008/053249 20080226
  • 国际申请: PCT/JP2008/053249 WO 20080226
  • 国际公布: WO2009/107196 WO 20090903
  • 主分类号: C23C16/00
  • IPC分类号: C23C16/00 C23C16/50
Method for plasma deposition and plasma CVD system
摘要:
In a film-forming process with a capacitively-coupled plasma (CCP) chemical vapor deposition (CVD) device, pulse control is performed on a low-frequency radio-frequency power source. During the pulse control, an ON time and an OFF time form one period. Furthermore, in the pulse control, a time interval between a time period from the moment that the electric power supply is stopped till the electron density decreases to a residual plasma threshold capable of causing an arc discharge and a time period from the moment that the electric power supply is stopped till the density of high-temperature electrons decreases to a specific plasma state serves as the OFF time; a saturation time during the rising process of the density of the high-temperature electrons in the plasma after the electric power supply is started serves as an upper limit of the ON time; and electric power is intermittently supplied under the above conditions.
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