发明授权
- 专利标题: Method for plasma deposition and plasma CVD system
- 专利标题(中): 等离子体沉积和等离子体CVD系统的方法
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申请号: US12811333申请日: 2008-02-26
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公开(公告)号: US08272348B2公开(公告)日: 2012-09-25
- 发明人: Masayasu Suzuki
- 申请人: Masayasu Suzuki
- 申请人地址: JP Kyoto
- 专利权人: Shimadzu Corporation
- 当前专利权人: Shimadzu Corporation
- 当前专利权人地址: JP Kyoto
- 代理机构: J.C. Patents
- 优先权: JPPCT/JP2008/053249 20080226
- 国际申请: PCT/JP2008/053249 WO 20080226
- 国际公布: WO2009/107196 WO 20090903
- 主分类号: C23C16/00
- IPC分类号: C23C16/00 ; C23C16/50
摘要:
In a film-forming process with a capacitively-coupled plasma (CCP) chemical vapor deposition (CVD) device, pulse control is performed on a low-frequency radio-frequency power source. During the pulse control, an ON time and an OFF time form one period. Furthermore, in the pulse control, a time interval between a time period from the moment that the electric power supply is stopped till the electron density decreases to a residual plasma threshold capable of causing an arc discharge and a time period from the moment that the electric power supply is stopped till the density of high-temperature electrons decreases to a specific plasma state serves as the OFF time; a saturation time during the rising process of the density of the high-temperature electrons in the plasma after the electric power supply is started serves as an upper limit of the ON time; and electric power is intermittently supplied under the above conditions.
公开/授权文献
- US20100285629A1 METHOD FOR PLASMA DEPOSITION AND PLASMA CVD SYSTEM 公开/授权日:2010-11-11
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