发明授权
- 专利标题: Semiconductor laser device
- 专利标题(中): 半导体激光器件
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申请号: US12718009申请日: 2010-03-05
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公开(公告)号: US08270446B2公开(公告)日: 2012-09-18
- 发明人: Takashi Shiota , Takeshi Kitatani
- 申请人: Takashi Shiota , Takeshi Kitatani
- 申请人地址: JP Kanagawa
- 专利权人: Oclaro Japan, Inc.
- 当前专利权人: Oclaro Japan, Inc.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2009-61093 20090313
- 主分类号: H01S5/00
- IPC分类号: H01S5/00
摘要:
High performance and high reliability of a semiconductor laser device having a buried-hetero structure are achieved. The semiconductor laser device having a buried-hetero structure is manufactured by burying both sides of a mesa structure by a Ru-doped InGaP wide-gap layer and subsequently by a Ru-doped InGaP graded layer whose composition is graded from InGaP to InP, and then, by a Ru-doped InP layer. By providing the Ru-doped InGaP graded layer between the Ru-doped InGaP wide-gap layer and the Ru-doped InP layer, the Ru-doped InGaP wide-gap layer and the Ru-doped InP layer not lattice-matching with each other can be formed as a buried layer with excellent crystallinity.
公开/授权文献
- US20100232468A1 SEMICONDUCTOR LASER DEVICE 公开/授权日:2010-09-16
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