发明授权
- 专利标题: Cooling arrangement for a rack mounted processing device
- 专利标题(中): 机架式处理装置的冷却装置
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申请号: US12787171申请日: 2010-05-25
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公开(公告)号: US08270171B2公开(公告)日: 2012-09-18
- 发明人: Susheela Nanjunda Rao Narasimhan , Hong Tran Huynh , Toan Nguyen , Duong Cu Lu , Phillip S. Ting
- 申请人: Susheela Nanjunda Rao Narasimhan , Hong Tran Huynh , Toan Nguyen , Duong Cu Lu , Phillip S. Ting
- 申请人地址: US CA San Jose
- 专利权人: Cisco Technology, Inc.
- 当前专利权人: Cisco Technology, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Brinks Hofer Gilson & Lione
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.
公开/授权文献
- US20110292602A1 COOLING ARRANGEMENT FOR A RACK MOUNTED PROCESSING DEVICE 公开/授权日:2011-12-01
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