发明授权
- 专利标题： De-clamping wafers from an electrostatic chuck
- 专利标题（中）： 从静电卡盘中取出晶片
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申请号： US12331619申请日： 2008-12-10
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公开(公告)号： US08270142B2公开(公告)日： 2012-09-18
- 发明人: William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
- 申请人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
- 申请人地址： US MA Beverly
- 专利权人： Axcelis Technologies, Inc.
- 当前专利权人： Axcelis Technologies, Inc.
- 当前专利权人地址： US MA Beverly
- 代理机构： Eschweiler & Associates, LLC
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
One embodiment of the present invention relates to a method for declamping a semiconductor wafer that is electrically adhered to a surface of an electrostatic chuck by a clamping voltage. In this method, the clamping voltage is deactivated. For a time following the deactivation, a first region of the wafer is lifted an first distance from the surface of the electrostatic chuck while a second region of the wafer remains adhered to the surface of the electrostatic chuck. A predetermined condition is monitored during the time. The second region is lifted from the surface of the electrostatic chuck when the predetermined condition is met.
公开/授权文献
- US20100142113A1 DE-CLAMPING WAFERS FROM AN ELECTROSTATIC CHUCK 公开/授权日：2010-06-10
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