The invention provides a method for manufacturing a piezoelectric vibrator, a piezoelectric vibrator, and an oscillator, whereby mounting of the piezoelectric vibrating piece by flip-chip bonding is ensured. A manufacturing method of a piezoelectric vibrator is a method for manufacturing a piezoelectric vibrator that includes: a base substrate; a lid substrate bonded to the base substrate; a piezoelectric vibrating piece including a crystal plate having on its outer surface excitation electrodes, and mount electrodes electrically connected to the excitation electrodes; inner electrodes to be electrically connected to the piezoelectric vibrating piece; and metal bumps to provide electrical interconnections between the inner electrodes and the mount electrodes. The method includes a inner electrodes forming step of forming the inner electrodes, a metal bump forming step of forming the metal bumps, and a mount step of bonding the mount electrodes of the piezoelectric vibrating piece to the metal bumps, wherein, in the mount step, the piezoelectric vibrating piece is mounted and fixed in such a manner that tips of the metal bumps are not in contact with the crystal plate.