Invention Grant
- Patent Title: Micro piezoresistive pressure sensor and manufacturing method thereof
- Patent Title (中): 微压阻式压力传感器及其制造方法
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Application No.: US12745745Application Date: 2008-04-21
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Publication No.: US08261617B2Publication Date: 2012-09-11
- Inventor: Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
- Applicant: Chang Auck Choi , Chang Han Je , Gunn Hwang , Youn Tae Kim , Sung Hae Jung , Myung Lae Lee , Sung Sik Lee , Seok Hwan Moon
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecomunications Research Institute
- Current Assignee: Electronics and Telecomunications Research Institute
- Current Assignee Address: KR Daejeon
- Priority: KR10-2007-0125467 20071205
- International Application: PCT/KR2008/002233 WO 20080421
- International Announcement: WO2009/072704 WO 20090611
- Main IPC: G01L9/06
- IPC: G01L9/06 ; B23P17/04

Abstract:
A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
Public/Granted literature
- US20100251826A1 MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-10-07
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