发明授权
US08248809B2 Inverter power module with distributed support for direct substrate cooling
有权
逆变器电源模块具有分布式支持，用于直接衬底冷却
- 专利标题： Inverter power module with distributed support for direct substrate cooling
- 专利标题（中）： 逆变器电源模块具有分布式支持，用于直接衬底冷却
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申请号： US12198723申请日： 2008-08-26
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公开(公告)号： US08248809B2公开(公告)日： 2012-08-21
- 发明人: David Harold Miller , Mark D. Korich , Terence G. Ward , Brooks S. Mann
- 申请人： David Harold Miller , Mark D. Korich , Terence G. Ward , Brooks S. Mann
- 申请人地址： US MI Detroit
- 专利权人： GM Global Technology Operations LLC
- 当前专利权人： GM Global Technology Operations LLC
- 当前专利权人地址： US MI Detroit
- 代理机构： Ingrassia Fisher & Lorenz P.C.
- 主分类号： H05K5/06
- IPC分类号： H05K5/06
摘要：
Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
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