发明授权
- 专利标题： Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof
- 专利标题（中）： 具有可安装的向内和向外互连的集成电路封装系统及其制造方法
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申请号： US13090192申请日： 2011-04-19
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公开(公告)号： US08241955B2公开(公告)日： 2012-08-14
- 发明人: Reza Argenty Pagaila , Byung Tai Do , Jong-Woo Ha
- 申请人： Reza Argenty Pagaila , Byung Tai Do , Jong-Woo Ha
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley M. Chang
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect.
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