发明授权
- 专利标题： Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method
- 专利标题（中）： 电子部件安装系统，电子部件放置装置和电子部件安装方法
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申请号： US12162588申请日： 2007-03-26
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公开(公告)号： US08240543B2公开(公告)日： 2012-08-14
- 发明人: Syoichi Nishi , Mitsuhaya Tsukamoto , Masahiro Kihara , Masafumi Inoue
- 申请人： Syoichi Nishi , Mitsuhaya Tsukamoto , Masahiro Kihara , Masafumi Inoue
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Pearne & Gordon LLP
- 优先权： JP2006-091201 20060329
- 国际申请： PCT/JP2007/057329 WO 20070326
- 国际公布： WO2007/116848 WO 20071018
- 主分类号： B23K31/12
- IPC分类号： B23K31/12 ; B23K31/00 ; H01L21/00
摘要：
Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.
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