Invention Grant
US08222365B2 Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom
有权
聚酰胺酰亚胺树脂，以及由其制得的无色透明柔性覆金属层压板和电路板
- Patent Title: Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom
- Patent Title (中): 聚酰胺酰亚胺树脂，以及由其制得的无色透明柔性覆金属层压板和电路板
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Application No.: US12518302Application Date: 2007-12-03
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Publication No.: US08222365B2Publication Date: 2012-07-17
- Inventor: Katsuya Shimeno , Takeshi Ito , Tomohiro Aoyama , Akira Nishimoto , Shoko Nagata , Tomoharu Kurita
- Applicant: Katsuya Shimeno , Takeshi Ito , Tomohiro Aoyama , Akira Nishimoto , Shoko Nagata , Tomoharu Kurita
- Applicant Address: JP Osaka
- Assignee: Toyo Boseki Kabushiki Kaisha
- Current Assignee: Toyo Boseki Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2006-334860 20061212
- International Application: PCT/JP2007/073292 WO 20071203
- International Announcement: WO2008/072495 WO 20080619
- Main IPC: C08G18/34
- IPC: C08G18/34 ; C08G73/14 ; B32B27/28
Abstract:
This disclosure relates to a polyamideimide resin containing a structure represented by formula (1):
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