发明授权
- 专利标题： HGA suspension pad barrier for elimination of solder bridging defect
- 专利标题（中）： HGA悬挂垫障碍消除焊料桥接缺陷
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申请号： US11973668申请日： 2007-10-09
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公开(公告)号： US08213121B2公开(公告)日： 2012-07-03
- 发明人: Melvin J. A. Dela Pena , Edmar C. Escober , Sandy E. Joson , Teddy T. Tabarangao
- 申请人： Melvin J. A. Dela Pena , Edmar C. Escober , Sandy E. Joson , Teddy T. Tabarangao
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies, Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies, Netherlands B.V.
- 当前专利权人地址： NL Amsterdam
- 主分类号： G11B21/16
- IPC分类号： G11B21/16 ; G11B21/24
摘要：
A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.
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