Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing the same
- Patent Title (中): 碳化硅半导体器件及其制造方法
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Application No.: US12515386Application Date: 2007-11-16
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Publication No.: US08198675B2Publication Date: 2012-06-12
- Inventor: Shin Harada , Takeyoshi Masuda
- Applicant: Shin Harada , Takeyoshi Masuda
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Christopher Ma
- Priority: JP2006-314014 20061121
- International Application: PCT/JP2007/072290 WO 20071116
- International Announcement: WO2008/062729 WO 20080529
- Main IPC: H01L29/161
- IPC: H01L29/161

Abstract:
A silicon carbide semiconductor device having excellent performance characteristics and a method of manufacturing the same are obtained. An extended terrace surface is formed at a surface of an initial growth layer on a 4H—SiC substrate by annealing with the initial growth layer covered with an Si film, and then a new growth layer is epitaxially grown on the initial growth layer. A 3C—SiC portion having a polytype stable at a low temperature is grown on the extended terrace surface, and a 4H—SiC portion is grown on the other region. A trench is formed by selectively removing the 3C—SiC portion with the 4H—SiC portion remaining, and a gate electrode of a UMOSFET is formed in the trench. A channel region of the UMOSFET can be controlled to have a low-order surface, and a silicon carbide semiconductor device having high channel mobility and excellent performance characteristics is obtained.
Public/Granted literature
- US20100314626A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-12-16
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