发明授权
- 专利标题： Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
- 专利标题（中）： 光敏树脂组合物，感光元件，抗蚀剂图案形成方法和印刷线路板的制造方法
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申请号： US12838025申请日： 2010-07-16
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公开(公告)号： US08198008B2公开(公告)日： 2012-06-12
- 发明人: Masahiro Miyasaka , Takashi Kumaki
- 申请人： Masahiro Miyasaka , Takashi Kumaki
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JPP2005-150133 20050523; JPP2006-105416 20060406
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; G03F7/004 ; G03F7/028
摘要：
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
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