Invention Grant
US08194968B2 Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
有权
用于在晶片上制造的器件使用电信息以执行一个或多个缺陷相关功能的方法和系统
- Patent Title: Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
- Patent Title (中): 用于在晶片上制造的器件使用电信息以执行一个或多个缺陷相关功能的方法和系统
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Application No.: US11970294Application Date: 2008-01-07
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Publication No.: US08194968B2Publication Date: 2012-06-05
- Inventor: Allen Park , Peter Rose , Ellis Chang , Brian Duffy , Mark McCord , Gordon Abbott
- Applicant: Allen Park , Peter Rose , Ellis Chang , Brian Duffy , Mark McCord , Gordon Abbott
- Applicant Address: US CA San Jose
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA San Jose
- Agent Ann Marie Mewherter
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
Various methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions are provided. One computer-implemented method includes using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions. The one or more defect-related functions include one or more post-mask, defect-related functions.
Public/Granted literature
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