发明授权
US08194356B2 Head-stack assembly including heat-dissipation and impedance-matching structure and hard-disk drive using the head-stack assembly
有权
头堆叠组件包括散热和阻抗匹配结构以及使用磁头组合组件的硬盘驱动器
- 专利标题： Head-stack assembly including heat-dissipation and impedance-matching structure and hard-disk drive using the head-stack assembly
- 专利标题（中）： 头堆叠组件包括散热和阻抗匹配结构以及使用磁头组合组件的硬盘驱动器
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申请号： US12644358申请日： 2009-12-22
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公开(公告)号： US08194356B2公开(公告)日： 2012-06-05
- 发明人: Kazuhiro Nagaoka , Tatemi Ido , Nobumasa Nishiyama , Yuji Soga
- 申请人： Kazuhiro Nagaoka , Tatemi Ido , Nobumasa Nishiyama , Yuji Soga
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies, Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies, Netherlands B.V.
- 当前专利权人地址： NL Amsterdam
- 优先权： JP2008-325688 20081222
- 主分类号： G11B5/55
- IPC分类号： G11B5/55
摘要：
A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.
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