发明授权
- 专利标题： Antennas using chip-package interconnections for millimeter-wave wireless communication
- 专利标题（中）： 天线采用毫米波无线通信的芯片封装互连
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申请号： US12437809申请日： 2009-05-08
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公开(公告)号： US08179333B2公开(公告)日： 2012-05-15
- 发明人: Fnu Rajanish , Nitin Jain , Gaurav Menon , Angelos Alexanian
- 申请人： Fnu Rajanish , Nitin Jain , Gaurav Menon , Angelos Alexanian
- 申请人地址： US CA San Diego
- 专利权人： Anokiwave, Inc.
- 当前专利权人： Anokiwave, Inc.
- 当前专利权人地址： US CA San Diego
- 主分类号： H01Q9/28
- IPC分类号： H01Q9/28
摘要：
A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
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