Invention Grant
US08173723B2 EMI/RFI shielding resin composite material and molded product made using the same
有权
EMI / RFI屏蔽树脂复合材料和使用其制成的模制产品
- Patent Title: EMI/RFI shielding resin composite material and molded product made using the same
- Patent Title (中): EMI / RFI屏蔽树脂复合材料和使用其制成的模制产品
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Application No.: US12621580Application Date: 2009-11-19
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Publication No.: US08173723B2Publication Date: 2012-05-08
- Inventor: Sung-Jun Kim , Chang-Min Hong
- Applicant: Sung-Jun Kim , Chang-Min Hong
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Summa, Additon & Ashe, P.A.
- Priority: KR10-2008-0125378 20081210
- Main IPC: G21F1/10
- IPC: G21F1/10
Abstract:
Disclosed is an electromagnetic wave EMI/RFI shielding resin composite material that includes a thermoplastic polymer resin, an electrically conductive filler having a polyhedral shape or being capable of forming a polyhedral shape, and a low-melting point metal, and a molded product made using the EMI/RFI shielding resin composite material.
Public/Granted literature
- US20100140534A1 EMI/RFI Shielding Resin Composite Material and Molded Product Made Using the Same Public/Granted day:2010-06-10
Information query
