Disclosed are embodiments of a circuit (e.g., an electrostatic discharge (ESD) circuit), a design methodology and a design system. In the circuit, an ESD device is wired to a first metal level (e.g., M1). An inductor is formed in a second metal level (e.g., M5) above the first metal level and is aligned over and electrically connected in parallel to the ESD device by a single vertical via stack. The inductor is configured to nullify, for a given application frequency, the capacitance value of the ESD device. The quality factor of the inductor is optimized by providing, on a third metal level (e.g., M3) between the second metal level and the first metal level, a shield to minimize inductive coupling. An opening in the shield allows the via stack to pass through, trading off Q factor reduction for size-scaling and ESD robustness improvements.