An integrated circuit (IC) includes a package substrate, a die, and a plurality of antenna structures. The die includes a radio frequency (RF) transceiver and a control module, wherein the RF transceiver processes inbound and outbound RF signals. The control module enables the RF transceiver to receive the inbound RF signal from one or more of the plurality of antenna structures in a frequency band of approximately 55 GHz to 64 GHz and enables the RF transceiver to provide the outbound RF signal to one or more of the plurality of antennas structures for transmission in a frequency band of approximately 55 GHz to 64 GHz.