发明授权
- 专利标题: Form factor adapter module
- 专利标题(中): 外形尺寸适配器模块
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申请号: US12102478申请日: 2008-04-14
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公开(公告)号: US08165471B2公开(公告)日: 2012-04-24
- 发明人: James Thomas Theodoras, II , Christophe Metivier , Travis Legg
- 申请人: James Thomas Theodoras, II , Christophe Metivier , Travis Legg
- 申请人地址: US CA San Jose
- 专利权人: Cisco Technology, Inc.
- 当前专利权人: Cisco Technology, Inc.
- 当前专利权人地址: US CA San Jose
- 主分类号: G02B6/36
- IPC分类号: G02B6/36 ; H01R4/28 ; G06F1/00 ; H04B10/00
摘要:
According to one example embodiment, a form factor adapter module may include a small form factor (SFF) host connector, an X2 or XENPAK edge finger connector, and a serial to XAUI transceiver. The SFF host connector may be configured receive a small form factor pluggable (SFP or SFP+) module and to transmit and receive data according to a Serial Gigabit Media Independent Interface (SGMII) or Serializer-deserializer Framer Interface (SFI) protocol. The X2 or XENPAK edge finger connector may be configured to mate with an X2 or XENPAK edge finger socket and to transmit and receive data according to a Ten Gigabit Ethernet Attachment Unit Interface (XAUI) protocol. The serial to XAUI transceiver may be coupled to both the SFF host connector and the X2 or XENPAK edge finger connector. The serial to XAUI transceiver may be configured to convert data between the SGMII or SFI protocol and the XAUI protocol.
公开/授权文献
- US20090257754A1 FORM FACTOR ADAPTER MODULE 公开/授权日:2009-10-15
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