Invention Grant
- Patent Title: Electronic component pressing device and electronic component test apparatus
- Patent Title (中): 电子元件按压装置和电子元件测试装置
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Application No.: US12527976Application Date: 2008-01-18
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Publication No.: US08164355B2Publication Date: 2012-04-24
- Inventor: Tsuyoshi Yamashita
- Applicant: Tsuyoshi Yamashita
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha • Liang LLP
- Priority: JP2007-043334 20070223
- International Application: PCT/JP2008/050579 WO 20080118
- International Announcement: WO2008/102581 WO 20080828
- Main IPC: G01R31/20
- IPC: G01R31/20
Abstract:
An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a predetermined second region other than the first region of the electronic component to be tested; a gimbal mechanism for adhering the first pressing member to the first region when the first pressing member presses the first region of the electronic component to be tested; first pressing load applying means for applying a pressing load on the gimbal mechanism; and second pressing load applying means for applying a pressing load on the second pressing member.
Public/Granted literature
- US20100019791A1 ELECTRONIC COMPONENT PRESSING DEVICE AND ELECTRONIC COMPONENT TEST APPARATUS Public/Granted day:2010-01-28
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