发明授权
- 专利标题： BGA semiconductor device having a dummy bump
- 专利标题（中）： BGA半导体器件具有虚拟凸块
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申请号： US11105546申请日： 2005-04-14
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公开(公告)号： US08164186B2公开(公告)日： 2012-04-24
- 发明人: Yuji Watanabe , Hisashi Tanie , Koji Hosokawa , Mitsuaki Katagiri , Ichiro Anjo
- 申请人： Yuji Watanabe , Hisashi Tanie , Koji Hosokawa , Mitsuaki Katagiri , Ichiro Anjo
- 申请人地址： JP Tokyo
- 专利权人： Elpida Memory, Inc.
- 当前专利权人： Elpida Memory, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2004-122011 20040416
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.
公开/授权文献
- US20050230824A1 BGA semiconductor device having a dummy bump 公开/授权日：2005-10-20
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