发明授权
- 专利标题: Cooling structure of electronic device
- 专利标题(中): 电子设备冷却结构
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申请号: US12843965申请日: 2010-07-27
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公开(公告)号: US08154871B2公开(公告)日: 2012-04-10
- 发明人: Shinichi Kuwahara
- 申请人: Shinichi Kuwahara
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2010-031823 20100216; JP2010-148125 20100629
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating fins projecting toward a second housing, a first flow-in portion provided to the first housing to be open in one of first directions, a second heat radiating member receiving heat generated by a second heat generating body, and including a plurality of second heat radiating fins projecting toward a first housing, and a first flow-out portion provided to the second housing to be open in one of second directions crossing the first directions. The cooling structure includes a cooling fan unit configured to supply the air that has flown from outside to the first heat radiating fins, thereafter supply the air to the second heat radiating fins and cause the air to flow to the outside.
公开/授权文献
- US20110199731A1 COOLING STRUCTURE OF ELECTRONIC DEVICE 公开/授权日:2011-08-18
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