Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US12699030Application Date: 2010-02-02
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Publication No.: US08147114B2Publication Date: 2012-04-03
- Inventor: Yu-Sheng Lin , Wan-Ten Chen , Chih-Hua Cheng , Yi-Ting Chen , Yung-Ta Huang , Shin-Yi Hsieh
- Applicant: Yu-Sheng Lin , Wan-Ten Chen , Chih-Hua Cheng , Yi-Ting Chen , Yung-Ta Huang , Shin-Yi Hsieh
- Applicant Address: TW Hsinchu County
- Assignee: E Ink Holdings Inc.
- Current Assignee: E Ink Holdings Inc.
- Current Assignee Address: TW Hsinchu County
- Agent Chun-Ming Shih
- Priority: TW98129460A 20090901
- Main IPC: F21V7/04
- IPC: F21V7/04

Abstract:
A backlight module includes a light guide plate and a flexible illuminating bar. The light guide plate has a light emitting top surface and a plurality of light incident side surfaces. Each of the light incident side surfaces is connected to the light emitting top surface. The flexible illuminating bar includes a circuit board module and a plurality of point light sources. The circuit board module includes a plurality of circuit boards and at least one flexible electrical connection member. The circuit boards are disposed at the light incident side surfaces, respectively. The flexible electrical connection member electrically connects two of the circuit boards and is bendingly disposed between corresponding two of the circuit boards. The point light sources are electrically disposed on the circuit boards and suitable for emitting light towards the light incident side surfaces. In addition, another backlight module is also provided.
Public/Granted literature
- US20110051398A1 Backlight Module Public/Granted day:2011-03-03
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