发明授权
US08143612B2 Phase change memory cell in via array with self-aligned, self-converged bottom electrode and method for manufacturing
有权
具有自对准,自会聚底电极的通孔阵列中的相变存储单元及其制造方法
- 专利标题: Phase change memory cell in via array with self-aligned, self-converged bottom electrode and method for manufacturing
- 专利标题(中): 具有自对准,自会聚底电极的通孔阵列中的相变存储单元及其制造方法
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申请号: US12621000申请日: 2009-11-18
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公开(公告)号: US08143612B2公开(公告)日: 2012-03-27
- 发明人: Hsiang-Lan Lung , Chung Hon Lam
- 申请人: Hsiang-Lan Lung , Chung Hon Lam
- 申请人地址: TW Hsinchu US NY Armonk
- 专利权人: Marconix International Co., Ltd.,International Business Machines
- 当前专利权人: Marconix International Co., Ltd.,International Business Machines
- 当前专利权人地址: TW Hsinchu US NY Armonk
- 代理机构: Haynes Beffel & Wolfeld LLP
- 主分类号: H01L29/06
- IPC分类号: H01L29/06
摘要:
An array of “mushroom” style phase change memory cells is manufactured by forming a separation layer over an array of contacts, forming an isolation layer on the separation layer and forming an array of memory element openings in the isolation layer using a lithographic process. Etch masks are formed within the memory element openings by a process that compensates for variation in the size of the memory element openings that results from the lithographic process. The etch masks are used to etch through the separation layer to define an array of electrode openings. Electrode material is deposited within the electrode openings; and memory elements are formed within the memory element openings. The memory elements and bottom electrodes are self-aligned.
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