A method for manufacturing a nonvolatile storage device with a plurality of unit memory layers stacked therein is provided. Each of the unit memory layers includes: a first interconnect extending in a first direction; a second interconnect extending in a second direction; a recording unit sandwiched between the first and second interconnects and being capable of reversibly transitioning between a first state and a second state in response to a current supplied through the first and second interconnects; and a rectifying element sandwiched between the first interconnect and the recording unit and including at least one of p-type and n-type impurities. In the method, the first interconnect, the second interconnect, the recording unit, and a layer of an amorphous material including the at least one of p-type and n-type impurities used in the plurality of unit memory layers are formed at a temperature lower than a temperature at which the amorphous material is substantially crystallized. The amorphous material used in the plurality of unit memory layers is simultaneously crystallized and the impurities included in the amorphous material used in the plurality of unit memory layers are simultaneously activated.