Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing the same
- Patent Title (中): 碳化硅半导体器件及其制造方法
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Application No.: US12513554Application Date: 2007-11-07
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Publication No.: US08138504B2Publication Date: 2012-03-20
- Inventor: Shin Harada , Takeyoshi Masuda
- Applicant: Shin Harada , Takeyoshi Masuda
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Leigh D. Thelen
- Priority: JP2006-305476 20061110
- International Application: PCT/JP2007/071630 WO 20071107
- International Announcement: WO2008/056698 WO 20080515
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L21/20

Abstract:
A silicon carbide semiconductor device having excellent performance characteristics and a method of manufacturing the same are obtained. A coating film made of Si is formed on an initial growth layer on a 4H—SiC substrate, and an extended terrace surface is formed in a region covered with the coating film. Next, the coating film is removed, and a new growth layer is epitaxially grown on the initial growth layer. A 3C—SiC portion made of 3C—SiC crystals having a polytype stable at a low temperature is grown on the extended terrace surface of the initial growth layer. A channel region of a MOSFET or the like is provided in the 3C—SiC portion having a narrow band gap. As a result, the channel mobility is improved because of a reduction in an interface state, and a silicon carbide semiconductor device having excellent performance characteristics is obtained.
Public/Granted literature
- US20100065857A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-03-18
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