Provided is a system for handling a semiconductor module, the system may include a rotor, a rotational driving device, at least one insertion portion, and at least one extraction portion. The rotor may be configured to rotate clockwise and counterclockwise around a rotation axis. The rotational driving device may be configured to rotate the rotor. The at least one insertion portion may be connected to the rotor and may be configured to insert a semiconductor module into a socket. The at least one extraction portion may be connected to the rotor and may be configured to extract the semiconductor module from the socket.