发明授权
- 专利标题： Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package
- 专利标题（中）： 导热构件，导热构件的制造方法，散热构件和半导体封装
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申请号： US12892075申请日： 2010-09-28
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公开(公告)号： US08130500B2公开(公告)日： 2012-03-06
- 发明人: Takuya Oda
- 申请人： Takuya Oda
- 申请人地址： JP Nagano
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano
- 代理机构： IPUSA, PLLC
- 优先权： JP2009-241684 20091020
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer.
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