发明授权
US08119035B2 Conductive pattern forming ink, conductive pattern, and wiring substrate
失效
导电图案形成油墨,导电图案和布线基板
- 专利标题: Conductive pattern forming ink, conductive pattern, and wiring substrate
- 专利标题(中): 导电图案形成油墨,导电图案和布线基板
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申请号: US12326677申请日: 2008-12-02
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公开(公告)号: US08119035B2公开(公告)日: 2012-02-21
- 发明人: Naoyuki Toyoda
- 申请人: Naoyuki Toyoda
- 申请人地址: JP Tokyo
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Global IP Counselors, LLP
- 优先权: JP2007-319016 20071210
- 主分类号: H01B1/02
- IPC分类号: H01B1/02 ; H01B1/22
摘要:
A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; erythritol; and a polyglycerol compound having a polyglycerol skeleton. In the ink, H shown in the following formula (I) is 0.15 to 0.80; H = OH ( A ) Mw ( A ) X ( A ) + OH ( B ) Mw ( B ) X ( B ) Formula ( I ) where OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents a number of hydroxyl groups in one molecule of the erythritol, Mw(B) represents a molecular weight of the erythritol, and X(B) represents a content of the erythritol in the conductive pattern forming ink in weight percent.
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