发明授权
- 专利标题： Laser dicing sheet and process for producing chip body
- 专利标题（中）： 激光切割片及其制造方法
-
申请号： US11949350申请日： 2007-12-03
-
公开(公告)号： US08114520B2公开(公告)日： 2012-02-14
- 发明人: Yoji Wakayama , Yosuke Sato , Naoki Taya
- 申请人： Yoji Wakayama , Yosuke Sato , Naoki Taya
- 申请人地址： JP Tokyo
- 专利权人： LINTEC Corporation
- 当前专利权人： LINTEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Hahn & Voight PLLC
- 代理商 Roger C. Hahn
- 优先权： JP2006-328609 20061205; JP2007-077906 20070323
- 主分类号： B32B27/40
- IPC分类号： B32B27/40 ; B23K26/00 ; C08G18/08
摘要：
An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table.A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.
公开/授权文献
- US20080190904A1 LASER DICING SHEET AND PROCESS FOR PRODUCING CHIP BODY 公开/授权日：2008-08-14
信息查询
