发明授权
US08112563B2 Arrangement comprising a first semiconductor chip and a second semiconductor chip connected thereto
有权
包括第一半导体芯片和与其连接的第二半导体芯片的布置
- 专利标题： Arrangement comprising a first semiconductor chip and a second semiconductor chip connected thereto
- 专利标题（中）： 包括第一半导体芯片和与其连接的第二半导体芯片的布置
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申请号： US10727102申请日： 2003-12-02
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公开(公告)号： US08112563B2公开(公告)日： 2012-02-07
- 发明人: Jens Barrenscheen , Peter Rohm , Hannes Estl , Axel Aue , Jens Graf , Herman Roozenbeek
- 申请人： Jens Barrenscheen , Peter Rohm , Angela Rohm, legal representative , Hannes Estl , Axel Aue , Jens Graf , Herman Roozenbeek
- 申请人地址： DE DE
- 专利权人： Infineon Technologies AG,Robert Bosch GmbH
- 当前专利权人： Infineon Technologies AG,Robert Bosch GmbH
- 当前专利权人地址： DE DE
- 代理机构： Dickstein Shapiro LLP
- 优先权： EP02026775 20021202
- 主分类号： G06F13/12
- IPC分类号： G06F13/12 ; G06F13/38
摘要：
An arrangement including a first semiconductor chip and a second semiconductor chip connected thereto, where the second semiconductor chip is additionally connected to electrical loads and drives these electrical loads on the basis of a timing which is prescribed to it by load control data, and where the first semiconductor chip transmits to the second semiconductor chip the aforementioned load control data and pilot data which control the second semiconductor chip, and where the second semiconductor chip transmits to the first semiconductor chip diagnostic data which represent states prevailing in the second semiconductor chip or events which occur. The diagnostic data are transmitted via a first transmission channel and the load control data and the pilot data are transmitted via a second transmission channel.
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