Invention Grant
- Patent Title: High electromagnetic transmission composite structure
- Patent Title (中): 高电磁传输复合结构
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Application No.: US12551323Application Date: 2009-08-31
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Publication No.: US08111206B2Publication Date: 2012-02-07
- Inventor: Cheng-Ching Lee , Jiunn-Shyong Lin , Shin-Hon Chen , Yie-Fan King , Dar-Chuen Lin
- Applicant: Cheng-Ching Lee , Jiunn-Shyong Lin , Shin-Hon Chen , Yie-Fan King , Dar-Chuen Lin
- Applicant Address: TW Taoyuan County
- Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
- Current Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
- Current Assignee Address: TW Taoyuan County
- Main IPC: H01Q1/42
- IPC: H01Q1/42

Abstract:
The invention discloses a high electromagnetic transmission composite structure for reducing the transmission loss of an electromagnetic wave. The high electromagnetic transmission composite structure includes a first composite structure layer, a second composite structure layer, and a first buffer layer. The first composite structure layer has a first thickness and a first dielectric constant. The second composite structure layer has a second thickness and a second dielectric constant. The first buffer is disposed between the first composite structure layer and the second composite structure layer and has a third thickness and a third dielectric constant. The transmission loss of the electromagnetism wave can be adjusted by adjusting the first thickness, the first dielectric constant, the second thickness, the second dielectric constant, the third thickness, and the third dielectric constant.
Public/Granted literature
- US20110050370A1 HIGH ELECTROMAGNETIC TRANSMISSION COMPOSITE STRUCTURE Public/Granted day:2011-03-03
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