发明授权
- 专利标题: Diamond semiconductor devices and associated methods
- 专利标题(中): 金刚石半导体器件及相关方法
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申请号: US11809719申请日: 2007-05-31
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公开(公告)号: US08110846B2公开(公告)日: 2012-02-07
- 发明人: Chien-Min Sung
- 申请人: Chien-Min Sung
- 代理机构: Thorpe North & Western LLP
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
Semiconductor devices and methods for making such devices are provided. One such method may include forming a transparent diamond layer having a SiC layer coupled thereto, where the SiC layer has a crystal structure that is substantially epitaxially matched to the transparent diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer, and coupling a diamond substrate to at least one of the plurality of semiconductor layers such that the diamond support is oriented parallel to the transparent diamond layer. In one aspect such a method may further include electrically coupling at least one of a p-type electrode or an n-type electrode to at least one of the plurality of semiconductor layers.
公开/授权文献
- US20110068350A1 Diamond semiconductor devices and associated methods 公开/授权日:2011-03-24
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