发明授权
- 专利标题: Light emitting device package for temeperature detection
- 专利标题(中): 用于温度检测的发光器件封装
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申请号: US12395756申请日: 2009-03-02
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公开(公告)号: US08093788B2公开(公告)日: 2012-01-10
- 发明人: Shan Mei Wan , Chi Hang Cheung , Ming Lu
- 申请人: Shan Mei Wan , Chi Hang Cheung , Ming Lu
- 申请人地址: CN Hong Kong
- 专利权人: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- 当前专利权人: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- 当前专利权人地址: CN Hong Kong
- 代理机构: Brooks Kushman P.C.
- 主分类号: H01J7/24
- IPC分类号: H01J7/24
摘要:
A light emitting device package and a lighting system are provided. According to one embodiment, a functional substrate; at least one light emitting element bonded onto the functional substrate; and at least one design-in thermal detection unit built onto the functional substrate are provided, wherein the design-in thermal detection unit is proximate to the light emitting element, and wherein the design-in thermal detection unit is configured to detect the temperature and transmit a temperature signal. The design-in thermal detection unit may be an NTC thermistor based on a semiconductor substrate. A control system may be included to detect temperature and make any necessary current adjustments in order to maintain consistent performance of the light emitting element.
公开/授权文献
- US20100219733A1 LIGHT EMITTING DEVICE PACKAGE FOR TEMEPERATURE DETECTION 公开/授权日:2010-09-02
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