发明授权
- 专利标题： Deposition apparatus and methods
- 专利标题（中）： 沉积设备和方法
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申请号： US11181616申请日： 2005-07-14
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公开(公告)号： US08067711B2公开(公告)日： 2011-11-29
- 发明人: Donn R. Blankenship , David A. Rutz , Norman A. Pietruska , Paul H. Zajchowski , Gary Shubert
- 申请人： Donn R. Blankenship , David A. Rutz , Norman A. Pietruska , Paul H. Zajchowski , Gary Shubert
- 申请人地址： US CT Hartford
- 专利权人： United Technologies Corporation
- 当前专利权人： United Technologies Corporation
- 当前专利权人地址： US CT Hartford
- 代理机构： Bachman & LaPointe, P.C.
- 主分类号： B23K10/00
- IPC分类号： B23K10/00
摘要：
Microspray apparatus and methods involve injecting powdered material into a plasma gas stream. The material comprises first and second component powders. The second powder is a majority by the weight of the powdered material. The first powder acts as a melting point depressant. The first and second powders may have similar compositions but with the first powder including a greater quantity of a melting point depressant element.
公开/授权文献
- US20100096368A1 Deposition apparatus and methods 公开/授权日：2010-04-22
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