A connector soldered to a PCB has an insulating housing of which two opposite ends recessed to form a pair of receiving recesses, terminals mounted in the insulating housing having soldering portions projected out of a bottom of the insulating housing, a positioning member. The positioning member has a base slice received in the receiving recess, a side edge of the front of the base slice extending downward and then being bent perpendicularly to form a soldering slice located to be lower than the bottom of the base for being soldered with the PCB. As the thickness of the base slice is less than the height of the receiving recess, intervals are accordingly formed between the positioning member and the top and bottom sides of the receiving recess to achieve an up-and-down movement of the positioning member.