发明授权
- 专利标题: Semiconductor integrated circuit and method of manufacturing the same
- 专利标题(中): 半导体集成电路及其制造方法
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申请号: US12230614申请日: 2008-09-02
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公开(公告)号: US08049274B2公开(公告)日: 2011-11-01
- 发明人: Dae-Ik Kim , Yong-Il Kim
- 申请人: Dae-Ik Kim , Yong-Il Kim
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2007-0089211 20070903
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A semiconductor integrated circuit includes a semiconductor substrate, a plurality of trenches formed to extend in one direction in the semiconductor substrate, at least one connecting trench connecting at least two of the plurality of trenches to each other, a plurality of trench transistors including a plurality of gate electrodes, each gate electrode partially filling a corresponding trench, and a capping layer filling the at least one connecting trench.
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