Since a spectroscopic module (1) has a plate-shaped body section (2), the spectroscopic module can be reduced in size by reducing the thickness of the body section (2). Moreover, since the body section (2) is plate-shaped, the spectroscopic module (1) can be manufactured, for example, by using a wafer process. More specifically, by providing lens sections (3), diffraction layers (4), reflection layers (6) and light detecting elements (7) in a matrix form on a glass wafer which becomes many body sections (2) and dicing the glass wafer, many spectroscopic modules (1) can be manufactured. This enables easy mass production of spectroscopic modules (1).