发明授权
- 专利标题： Solid-state image pickup device and method for manufacturing same
- 专利标题（中）： 固体摄像装置及其制造方法
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申请号： US12486244申请日： 2009-06-17
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公开(公告)号： US08039883B2公开(公告)日： 2011-10-18
- 发明人: Yusuke Kohyama
- 申请人： Yusuke Kohyama
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2008-162359 20080620
- 主分类号： H01L31/062
- IPC分类号： H01L31/062 ; H01L31/113 ; H01L31/00 ; H01L23/544
摘要：
In a solid-state image pick up device, a first conduction type semiconductor layer which has a first surface side. A second surface side which is located the opposite side of the first surface side and an image sensor area. A photo-conversion area which is configured in the first surface side and charges electron by photoelectric conversion. A first diffusion area of second conduction type for isolation, wherein the first diffusion area surrounds the photo-conversion area and extends from the first surface side to the middle part of the semiconductor layer and a second diffusion area of second conduction type for isolation, wherein the second diffusion area extends from the second surface side to the bottom of the first diffusion layer.
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