发明授权
- 专利标题: Insulated gate silicon carbide semiconductor device and method for manufacturing the same
- 专利标题(中): 绝缘栅碳化硅半导体器件及其制造方法
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申请号: US12842116申请日: 2010-07-23
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公开(公告)号: US08039346B2公开(公告)日: 2011-10-18
- 发明人: Katsunori Ueno
- 申请人: Katsunori Ueno
- 申请人地址: JP
- 专利权人: Fuji Electric Co., Ltd.
- 当前专利权人: Fuji Electric Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Rossi, Kimms & McDowell LLP
- 优先权: JP2007-017945 20070129
- 主分类号: H01L21/8236
- IPC分类号: H01L21/8236
摘要:
An insulated gate silicon carbide semiconductor device is provided having small on-resistance in a structure obtained by combining the SIT and MOSFET structures having normally-off operation. The device includes an n− semiconductor layer on an SiC n+ substrate, a p-type base region and highly doped p-region both buried in the layer, a trench from the semiconductor layer surface to the p-base region, an n+ first source region in the surface of a p-type base region at the bottom of the trench, a p-type channel region in the surface of the sidewall of the trench, one end of which contacts the first source region, a gate electrode contacting the trench-side surface of the channel region via a gate insulating film, and a source electrode contacting the trench-side surface of the gate electrode via an interlayer insulating film and contacting the exposed first source region and p-base region at the bottom of the trench.
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