Invention Grant
- Patent Title: Laser processing apparatus, laser processing method, manufacturing method of wiring substrate, manufacturing method of display apparatus and wiring substrate
- Patent Title (中): 激光加工装置,激光加工方法,布线基板的制造方法,显示装置的制造方法和布线基板
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Application No.: US11860199Application Date: 2007-09-24
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Publication No.: US08013270B2Publication Date: 2011-09-06
- Inventor: Kazuhito Shimoda , Ryo Koshiishi , Satoshi Tomioka , Hideo Kawabe
- Applicant: Kazuhito Shimoda , Ryo Koshiishi , Satoshi Tomioka , Hideo Kawabe
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JPP2006-275322 20061006; JPP2007-002585 20070110
- Main IPC: B23K26/04
- IPC: B23K26/04 ; A61N5/00

Abstract:
A laser processing apparatus includes a support table, a local exhaust device, and a laser light source unit. The support table supports a processing object. The local exhaust device directs laser light into a local exhaust unit in which pressure is locally adjusted over the support table. The laser light source unit outputs the laser light. The local exhaust device is capable of relatively being lifted from the support table by injecting a lift gas to the support table. The processing object includes a multilayer film formed of two or more layers with different materials. An input unit into which reflectance of the processing object is inputted is connected to the laser light source unit.
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