发明授权
- 专利标题： Package for light emitting device
- 专利标题（中）： 发光装置包装
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申请号： US13036947申请日： 2011-02-28
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公开(公告)号： US08003997B2公开(公告)日： 2011-08-23
- 发明人: Park Jun Seok
- 申请人： Park Jun Seok
- 申请人地址： KR Seoul
- 专利权人： LG Innotek Co., Ltd
- 当前专利权人： LG Innotek Co., Ltd
- 当前专利权人地址： KR Seoul
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： KR10-2004-0107782 20041217; WOPCT/KR2005/002368 20050721
- 主分类号： H01L29/267
- IPC分类号： H01L29/267
摘要：
The present invention discloses a light emitting device package, comprising: a metal base; an electrical circuit layer provided at an upper side of the metal base for providing a conductive path; a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base; an insulating layer sandwiched between the meta base and the electrical circuit layer; an electrode layer provided at an upper side of the electrical circuit layer; and a wire for electrically connecting the electrode layer and the light emitting device. Further, there is provided a light emitting device package which is improved in light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.
公开/授权文献
- US20110147781A1 PACKAGE FOR LIGHT EMITTING DEVICE 公开/授权日：2011-06-23
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