发明授权
US07989940B2 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
有权
用于通过孔通过相同尺寸的封装的线接合堆叠来增加球栅格封装上的IO数量的系统和方法
- 专利标题： System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
- 专利标题（中）： 用于通过孔通过相同尺寸的封装的线接合堆叠来增加球栅格封装上的IO数量的系统和方法
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申请号： US11014506申请日： 2004-12-15
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公开(公告)号： US07989940B2公开(公告)日： 2011-08-02
- 发明人: Belgacem Haba , Masud Beroz
- 申请人： Belgacem Haba , Masud Beroz
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, JEDEC ball out, and die exposure. The polymeric tape layers have surface circuits (e.g., leads, pads, and wiring) located on the surface.
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