发明授权
US07978473B2 Cooling apparatus with cold plate formed in situ on a surface to be cooled
有权
具有冷板的冷却装置在待冷却的表面上原位形成
- 专利标题： Cooling apparatus with cold plate formed in situ on a surface to be cooled
- 专利标题（中）： 具有冷板的冷却装置在待冷却的表面上原位形成
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申请号： US12706912申请日： 2010-02-17
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公开(公告)号： US07978473B2公开(公告)日： 2011-07-12
- 发明人: Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
- 申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Heslin Rothenberg Farley & Mesiti P.C.
- 代理商 Dennis Jung, Esq.; Kevin P. Radigan, Esq.
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/20 ; H01L23/34
摘要：
A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
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