发明授权
US07977953B2 In-mould molding touch module and method for manufacturing the same 有权
模内成型触摸模块及其制造方法

  • 专利标题: In-mould molding touch module and method for manufacturing the same
  • 专利标题(中): 模内成型触摸模块及其制造方法
  • 申请号: US11963795
    申请日: 2007-12-22
  • 公开(公告)号: US07977953B2
    公开(公告)日: 2011-07-12
  • 发明人: Min-Yi Lee
  • 申请人: Min-Yi Lee
  • 申请人地址: TW Taipei
  • 专利权人: TPK Touch Solutions Inc.
  • 当前专利权人: TPK Touch Solutions Inc.
  • 当前专利权人地址: TW Taipei
  • 代理商 Gokalp Bayramoglu; Anna Tsang
  • 优先权: TW96139593A 20071023
  • 主分类号: G01R27/26
  • IPC分类号: G01R27/26 G09G5/00
In-mould molding touch module and method for manufacturing the same
摘要:
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
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