发明授权
- 专利标题: In-mould molding touch module and method for manufacturing the same
- 专利标题(中): 模内成型触摸模块及其制造方法
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申请号: US11963795申请日: 2007-12-22
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公开(公告)号: US07977953B2公开(公告)日: 2011-07-12
- 发明人: Min-Yi Lee
- 申请人: Min-Yi Lee
- 申请人地址: TW Taipei
- 专利权人: TPK Touch Solutions Inc.
- 当前专利权人: TPK Touch Solutions Inc.
- 当前专利权人地址: TW Taipei
- 代理商 Gokalp Bayramoglu; Anna Tsang
- 优先权: TW96139593A 20071023
- 主分类号: G01R27/26
- IPC分类号: G01R27/26 ; G09G5/00
摘要:
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
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