发明授权
- 专利标题： Electronic device including dies, a dielectric layer, and a encapsulating layer
- 专利标题（中）： 包括管芯，电介质层和封装层的电子器件
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申请号： US12398603申请日： 2009-03-05
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公开(公告)号： US07977785B2公开(公告)日： 2011-07-12
- 发明人: Jinbang Tang
- 申请人： Jinbang Tang
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/552
- IPC分类号： H01L23/552
摘要：
An electronic device and a method of packaging an electronic device are disclosed. In one embodiment, the electronic device can include a first die. The electronic device can also include a dielectric layer defining a first opening. The first die can be disposed within the first opening. Further, the electronic device can include an encapsulating material disposed adjacent to the first die. The encapsulating material can have a different composition as compared to the dielectric layer. In a particular embodiment, the electronic device can also include an electrically conductive carrier contacting the dielectric layer and the encapsulating material.
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