A multichip discrete package with a leadframe having a plurality of leads and a first die attach pad (DAP), the first DAP having side portions that extend above the first DAP, a first discrete die bonded to the first DAP, at least a first wirebond which forms an electrical connections between the first discrete die and a first selected one of the plurality of leads, a metal plate attached to tops of the side portions forming a second DAP, a second discrete die bonded to the second DAP, at least a second wirebond which forms an electrical connections between the second discrete die and a second selected one of the leads; and encapsulating material formed around the first and second die and the first and second DAPs.