Using a photosensitive resin composition comprising a polyimide (a) having, at the end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, an unsaturated bond-containing polymerizable compound (b1) represented by the general formula (1), and a photopolymerization initiator (c), it is possible to conduct alkaline development and to form a polyimide film having excellent heat resistance, strength and elongation.